PHOTOSENSITIVE FILM: Specifically engineered for PCB prototyping and circuit board manufacturing. Ideal for plating, hole covering, and the etching process
VERSATILE PCB FABRICATION SOLUTION: Delivers exceptional hole coverage capability with high resolution precision. Maintains strong adhesion on various substrates boards
RESOLUTION: High resolution. Ensures sharps pattern definition after exposure and development
SIZE: 30cmx500cm / 11.8x197in. Weighs only 150g for portable workshop use
STEP-BY-STEP APPLICATION PROCESS: 1) Uncover the film and sandwichs the photographic film between two layers of film 2) Apply the film, clean it, and stick it down smoothly 3) Slightly heat it with an electric iron to fix it 4) Print the circuit board film 5) Expose 6) Develop 7) Etch 8) Remove
وصف
Steps of use:
1. Film uncovering, the photographic film is sandwiched between two layers of films.
2. Film pasting, clean and paste flat.
3. Heat slightly to fix with electric iron.
4. Print circuit board film.
5. Exposure
6. Develop
7. Etch
8. Demould