مميزات خاصة

[SIMPLE CARRYING]: Convenient size and lightweight design make it easy to carry and work on. The phone CPU rework stencil is for on-the-go repairs.
[STAINLESS STEEL DURABILITY]: Constructed from premium stainless steel, this stencil is built to last with a sturdy design. Ideal for long-term use and reliability.
[IC CHIP PROTECTION]: Special IC slots prevent small IC tin from sticking and breaking, ensuring the safety of your valuable components during reballing.
[QUICK TINNING SPEED]: Fast and accurate positioning for high-speed tinning, this stencil maintains its shape even under extreme temperatures. Efficiency at its best.
[ FITTING DESIGN]: Compatible with CPU and popular like 11, 11 Pro, and 11 Pro , this stencil offers precision and versatility for various repairs.

وصف

Specification:
Item Type: Phone CPU BGA Reballing Stencil
Product Material: Stainless Steel
Spacing: 0.12mm
Applicable CPU: For
Applicable Product : For 11, for 11 Pro, for 11 Pro .

How to Use:
Directuse.

Package List:
1 xPhone CPU BGA Reballing Stencil
1 x
Phone CPU BGA Reballing Stencil

منتجات شبيهه

{"error":"\u062e\u0637\u0623","cart_limit":"\u0644\u062f\u064a\u0643 \u0627\u0644\u0643\u062b\u064a\u0631 \u0645\u0646 \u0627\u0644\u0645\u0646\u062a\u062c\u0627\u062a \u0641\u064a \u0633\u0644\u0629 \u0627\u0644\u062a\u0633\u0648\u0642 \u0627\u0644\u062e\u0627\u0635\u0629 \u0628\u0643.","prod_limit":"\u0644\u0627 \u064a\u0645\u0643\u0646\u0643 \u0625\u0636\u0627\u0641\u0629 \u0627\u0644\u0645\u0632\u064a\u062f \u0645\u0646 \u0647\u0630\u0627 \u0627\u0644\u0645\u0646\u062a\u062c"}

مرحبًا،

بحث

وحدة المعالجة المركزية للهاتف المضغوطة من الفولاذ المقاوم للصدأ BGA تعيد الاستنسل 0.12 مم لـ 11 ، 11 Pro ، Pro مع صغار سريع

مميزات خاصة

وصف

منتجات شبيهه