The Sn42Bi57Ag1 Low Temperature Solder Paste is made for low temperature applications. It spreads and adheres well to a variety of materials and provides excellent soldering results and appearance. This uniform paste dispenses evenly and resists solder beading and bright spots. Technical Information available on the Specification Sheet in Drop Down menu. Applications & Usages: The solder paste is designed to is used for LEDs and telecommunication assemblies. Storage and Shelf Life: Store refrigerated between 2–10 °C [35–50 °F] to minimize solvent evaporation, flux separation, and chemical activity. Store syringes in an upright position with tip down to prevent flux separation and air entrapment. Bring the paste to room temperature prior to use. To warm the refrigerated paste, let the unopened container stand for 4 hours at ambient temperature before use. For faster warm up, place the sealed container in a water bath at ambient temperature for 30 minutes. Unopened Container 2–10 °C [35–50 °F] 6 months from date of manufacture.