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مجموعة PTM7950 من CSGR & U6 PRO 20 جرام - الإدارة الحرارية القصوى للأنظمة عالية الأداء in Kuwait مجموعة PTM7950 من CSGR & U6 PRO 20 جرام - الإدارة الحرارية القصوى للأنظمة عالية الأداء in Kuwait مجموعة PTM7950 من CSGR & U6 PRO 20 جرام - الإدارة الحرارية القصوى للأنظمة عالية الأداء in Kuwait مجموعة PTM7950 من CSGR & U6 PRO 20 جرام - الإدارة الحرارية القصوى للأنظمة عالية الأداء in Kuwait مجموعة PTM7950 من CSGR & U6 PRO 20 جرام - الإدارة الحرارية القصوى للأنظمة عالية الأداء in Kuwait

مجموعة PTM7950 من CSGR & U6 PRO 20 جرام - الإدارة الحرارية القصوى للأنظمة عالية الأداء

KWD 12.500

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مميزات خاصة

  • Optimal Thermal Management: This set includes PTM7950 by CSGR (40x40x0.25mm) and U6 PRO 20g, combining advanced phase change material with high-performance thermal putty for superior cooling.
  • Exceptional Thermal Conductivity: PTM7950 features a thermal conductivity of 8.5 W/m.K* and phase change at 45°C, while U6 PRO boasts a thermal conductivity of 12.8 W/m.K*, ideal for high-temperature systems.
  • Highly Recommended: This combination is widely recommended on forums and YouTube as the best solution for achieving maximum thermal performance, perfect for overclocking and high-performance applications.
  • Easy Application and Maintenance: Both PTM7950 and U6 PRO are easy to apply and maintain. PTM7950 provides efficient phase change cooling, while U6 PRO is ideal for high-temperature environments, offering superior thermal management.

وصف

PTM7950 & U6 PRO 20g Set offers a top-tier thermal management solution combining two high-quality products: PTM7950 by CSGR and U6 PRO. The PTM7950, with dimensions 40x40x0.25mm and a thermal conductivity of 8.5 W/m.K*, changes phase at 45°C to efficiently manage heat. It works in perfect synergy with U6 PRO, a thermal putty with a thermal conductivity of 12.8 W/m.K*, designed for stable operation in high-temperature environments. The U6 PRO is ideal for replacing thicker thermal pads, up to 3.5mm, and is highly recommended for high-performance systems including gaming PCs, high-end video boards, and industrial electronics. This combination is frequently recommended on forums for achieving optimal cooling and thermal performance, especially in overclocked systems. *Computer Systems materials science laboratory testing: Method using a comparative technique (P. Karydopoulos, P. Frantzis, N. Karagiannis MSAIJ 2014).

منتجات شبيهه


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