APPLICATIONS:
Provide optimal heat transfer between CPU and heatsink through a metal oxide compound. High-demand applications, such as overclocking and high-performance CPUs.
Replace old or dried-out thermal paste.
FEATURES:
- Designed for Overclocking
- Especially for overclocking
- Excellent thermal conductivity
- No curing
- High long-term stability
- Not electrically conductive
FULFILLS THE HIGHEST EXPECTATIONS OF THE OVERCLOCKING COMMUNITY.
SPECIFICATION:
Thermal Conductivity: 14.6 W/m.k
Density: 3.2 g/cm3
Viscosity: 88 Poise
Thermal Resistance: 0.01 c°. in'/W @10psi
Volume Resistivity: 1.0 x 101 Q·cm
Silicone-based: Yes
Temperature: -30~150C
Color: Grey
Net Weight: 2grams
Typical Applications:
CPUs, GPUs, Notebooks, ICs, Heatsink, etc.
What's in the Box
1 - 2g Thermal Grease