مميزات خاصة

MINIMIZATION OF THERMAL RESISTANCE- The thinner the pad, the lower the thermal resistance. Thanks to its good compression properties, the very soft heat conduction pad is particularly a good heat conductor
EXCELLENT PERFORMANCE- Temperature: -40-180° . Upgraded thermal tape materials greatly improve the heat transfer between electronic components and effectively reduce the temperature within seconds.
THERMAL CONDUCTIVITY-quality thermal silica gel material with 2.0 walt/ thermal conductivity which can meets the requirements of middle and low-end anti-heat and belongs to the middle-end flagship thermal conductive silicon film.
VERSATILE APPLICATIONS-5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive,Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
SAFE HANDLING-It contains no metal particles, is electrically insulating and non-capacitive. Handling is therefore safe, as contact with electrical parts will not cause damage

وصف

Specification: Thermal Conductivity: 2 W/mKThickness: 3.0 mmColor: Dark GrayDielectric Breakdown Voltage: 5 KV/mmDensity: 2 g/cm³Working Temperature: -40-180°CVolume Resistance: 3x10^12Elongation: 160 PercentHardness: Shore 00 55 Application: Suitable for low-power productsElectronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC and a release paper (underneath).3. After tearing off the release paper, gently attach the thermally conductive silicon pad to the heat source.4. Remove the protective film5. Apply components onto the exposed part and apply pressure at fixture. Storage: Store in a cool, dry place away from direct sunlight.

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مميزات خاصة

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