The thermal pad is used to transfer heat from the chip (bridge, microcircuit, VRM) to the cooling system. Those. to reduce the temperature of the chip, crystal

The set of 50 pcs includes thermal pads in the size:

15 * 15 mm thickness 0.5 mm - 10 pieces

15 * 15 mm thickness 1.0 mm - 8 pieces

15 * 15 mm thickness 1.0 mm with 3M tape on both side - 6 pcs

15 * 15 mm thickness 1.5 mm with 3M tape on both sides - 6 pcs

15 * 15 mm thickness 1.5 mm - 6 pieces

15 * 15 mm thickness 2.0 mm - 7 pieces

15 * 15 mm thickness 2.5 mm - 7 pieces

Thermal conductivity honest 3.6 W / mk

>Thermal pads can be stacked on top of one another to increase thickness - properties are not lost

>The soft thermal pad is a non-phase change material (the so-called phase change refers to that the thermal pad will change when it is heated or cooled, and it will become liquid and solid when heated). No phase change (In simplest terms, WILL NOT FLOW)

Note: please, don`t forget to remove film before use

>The thermal pads with 3M is usual thermal pads with a very sticky layer on both sides for gluing additional heatsinks. Or use without a pressure pad