Specification:
Item Type: Semiconductor Cold Plate
Semiconductor Cold Plate: TEC1-12706
Size: 40 x 40 x 3.75 mm/40 x 40 x 3.75 mm/40 x 1.57 x 0.15 inches
Internal resistance: 2.1~2.4Ω
Highest temperature difference: above 67°C
Rated voltage: 12V (Vmax. 15V, starting current 5.8A)
Working Current: Imax.= 4~4.6A (12V Rated)
Cooling power: up to 50~60 watts
Working environment: -55~83℃
Sealing process: standard 704 silicone rubber seal on all sides
Fan: DC 12V
Conductive module size: 60 x 45 x 30 mm/6.36 x 1.77 x 1.18in
Water block size: 40 x 40 x 12mm/1.57 x 1.57 x 0.47in
Fan size: 40 x 40 x 10 mm/1.57 x 1.57 x 0.39in
Package List:
1 x Thermal module (heat sink)
1 x Water Block (Water)
1 x TEC1-12706 (semiconductor cold plate)
1 x Thermal Grease
1 x Fan
1 x Aluminum substrate
1 x Screw Mounting Kit
Note:
1. When the temperature is below -25 ° C, the conduction cooling module will freeze.TEC1-12706: One side is the cooling side and the other side is the side of the heat sink.A heat sink or water-cooled heat sink should be installed on the heat dissipation side;Otherwise, the cold sink will burn. DC power, prepare. I redo yourself.