DURABLE 304 STAINLESS STEEL: Crafted from 304 stainless steel plates with precise calcination, these BGA reballing stencils offer optimal thickness and exceptional resistance to deformation during hot air rework, ensuring long-lasting performance for every repair.
HEAT- & STABLE: Designed for hot air blower use, these BGA template kits maintain structural integrity under high temperatures without warping, providing reliable and consistent results for professional and DIY reballing tasks.
9 VERSATILE SPECIFICATIONS: This set includes 9 silver tin implantation templates in sizes from 0.3mm to 0.76mm, covering a wide range of ball pitches (P=0.58mm to P=1.27mm) to meet diverse reballing requirements for various chips.
EASY IDENTIFICATION & USE: Each stencil features clearly marked specifications on its surface, allowing for quick selection and direct use without guessing, streamlining your BGA rework process.
WIDE COMPATIBILITY: Suitable for reballing notebooks, desktop computers, communication motherboard north and south bridges, graphics cards, and other BGA components, thanks to the stable structure and universal design of these steel templates.