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Phone Cooling Pad Aluminum Heat Sink for Gaming Mobile Cooler Adhesive Plate 108x61.5mm in Kuwait Phone Cooling Pad Aluminum Heat Sink for Gaming Mobile Cooler Adhesive Plate 108x61.5mm in Kuwait Phone Cooling Pad Aluminum Heat Sink for Gaming Mobile Cooler Adhesive Plate 108x61.5mm in Kuwait Phone Cooling Pad Aluminum Heat Sink for Gaming Mobile Cooler Adhesive Plate 108x61.5mm in Kuwait Phone Cooling Pad Aluminum Heat Sink for Gaming Mobile Cooler Adhesive Plate 108x61.5mm in Kuwait Phone Cooling Pad Aluminum Heat Sink for Gaming Mobile Cooler Adhesive Plate 108x61.5mm in Kuwait Phone Cooling Pad Aluminum Heat Sink for Gaming Mobile Cooler Adhesive Plate 108x61.5mm in Kuwait

Phone Cooling Pad Aluminum Heat Sink for Gaming Mobile Cooler Adhesive Plate 108x61.5mm

KWD 2.500

1 +

مميزات خاصة

  • HIGH THERMAL CONDUCTIVITY ALUMINUM: Made from aluminum with excellent thermal conductivity for efficient heat transfer; Helps draw heat away from the device surface for effective cooling; Maintains lower operating temperatures during intensive gaming
  • CLIP COMPATIBILITY: Features rings that work with both coolers and back clip radiators; Provides flexible cooling options for different device setups; Adapts to various cooling fan types for versatile use
  • FREE ADHESIVE: High viscosity adhesive backing allows repeated application without losing hold; Removes cleanly without leaving sticky residue on device surfaces; Provides secure attachment while maintaining device appearance
  • LARGE EFFECTIVE COOLING AREA: Generous 108 by 61.5 millimeter surface area covers more device surface for better cooling; Distributes cooling effect across a wider area for heat dissipation; Maximizes the efficiency of attached cooling
  • THIN COMPACT PROFILE DESIGN: thin 1.4 millimeter profile adds minimal bulk to your device; Allows easy attachment without interfering handling; Maintains comfortable grip while providing effective thermal management

وصف

This phone cooling pad is crafted from aluminum with high thermal conductivity, providing efficient heat dissipation for mobile devices during extended gaming and heavy use
The pad features an adhesive backing that can be reused without leaving traces, along with rings compatible with both and back clip coolers
Designed for use with cooling, this 108 by 61.5 millimeter pad helps maintain optimal device temperatures for consistent performance
Features: Aluminum cooling pad with high thermal conductivity for efficient heat dissipation
design compatible with radiators and back clip coolers
high viscosity adhesive backing leaves no traces when removed
Large 108 by 61.5 millimeter surface area for effective cooling coverage
Suitable for gaming phones and devices during extended use
Works with cooling for enhanced heat dissipation
Compact 1.4 millimeter thickness for minimal bulk
Specifications:
: Iron and aluminum
Size: Approx 108 mm x 61.5 mm x 1.4 mm
Color: Black
Package Includes:
phone cooling pad
Other accessories shown in pictures are not included
Note:
This cooling pad is designed for use with a compatible cooling fan
Please allow millimeter error due to manual measurement
Actual color may vary slightly due to different monitor settings

منتجات شبيهه


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