مميزات خاصة

💖1.Nano-level + Micro-level + Spherical Powders Nano-level (40–200nm) and micro-level (1–60μm) spherical aluminum nitride powders, with high spherical particle shape, uniform particle size distribution, and excellent fluidity. Compared to irregular powders, the spherical structure has a higher filling rate, is less prone to clogging, and results in more uniform mixing, significantly reducing the thickening problem of the resin system. It is suitable for various polymer filling and modification scenarios.
💖2. Ultra-high thermal conductivity + Pure insulation: Dual-core performance Aluminum nitride is a high-end ceramic material for electronic heat dissipation. Its thermal conductivity exceeds that of conventional heat dissipation powders such as alumina and magnesium oxide, and it has excellent thermal conductivity. The product has excellent electrical insulation properties, with no heat conduction and no electricity conduction, perfectly addressing the industry pain point of coexistence of heat dissipation and insulation for high-power equipment, eliminating the risks of leakage and breakdown, and is suitable for high-precision electronic components.
💖3. High-purity low-oxygen modification with strong hydrolytic stability The powder purity is ≥ 99.9%, with low oxygen content and extremely low impurity content. After professional surface modification treatment, it effectively enhances the powder's resistance to hydrolysis, moisture-proofing, and oxidation capabilities. It performs stably in high-humidity and high-temperature processing environments, is not prone to failure, and has excellent compatibility with silica gel, epoxy resin, polyurethane, and plastic substrates. The product consistency is higher.
💖4. Wide range of applications: Industrial mass production + general research use It is widely used in thermal interface materials such as thermal silicone sheets, thermal silicone pastes, thermal encapsulation adhesives, thermal plastics, and thermal coatings; it is also applicable to semiconductor electronic packaging, high-power LED heat dissipation, microwave devices, sintering of aluminum nitride ceramic substrates, and preparation of high-temperature crucibles. It is also the core raw material for new material research in university laboratories and modification of composite materials.
💖5. Multiple Specifications and Customization Standard packaging sizes include 50g, 100g, 500g, and 1kg. Customization is available for special particle size, surface coating modification, and high-purity requirements. Complete sets of materials such as MSDS and component test reports can be provided.

وصف

💖This product is high-quality aluminum nitride powder (AlN), available in two series—nano-scale and micro-scale—prepared using advanced technology. The particles are smooth, uniform, well-dispersed, and have a high bulk density, making it the preferred inorganic ceramic filler for high-end thermal conductive insulation applications.
💖Traditional alumina powders have limited thermal conductivity and cannot meet the heat dissipation requirements of high-frequency, high-power electronic devices. In contrast, aluminum nitride powder offers multiple advantages, including ultra-high thermal conductivity, excellent electrical insulation, high-temperature resistance, corrosion resistance, and a low coefficient of thermal expansion. Its spherical morphology addresses the issues associated with conventional powders—such as low filling capacity, high system viscosity, and poor dispersion—significantly enhancing both the overall heat dissipation performance and forming quality of composite materials.
💖The powder undergoes fine purification and surface modification, featuring low oxygen content, minimal impurities, moisture resistance, and hydrolysis resistance. It remains stable over long-term use without absorbing moisture or degrading, making it suitable for both industrial continuous production and laboratory precision experiments.
💖Applications:
💖 Thermal interface materials: thermal pads, thermal grease, heat dissipation gels, high-temperature-resistant potting compounds
💖 Electronic packaging: chip packaging, high-power LEDs, new energy electronics, microwave component filling
💖 Ceramic fabrication: aluminum nitride ceramic substrates, high-temperature resistant ceramic structural components, sintered body raw materials
💖 Material modification: thermally conductive plastics, thermally conductive coatings, and insulation composite materials filled and modified
💖 Research and experimental work: new material development, composite material testing, sintering experiments in universities and research institutes
💖Basic Product Specifications
💖 Product Name: Aluminum Nitride Powder
💖 English Abbreviation: AlN
💖 CAS Number: 24304-00-5
💖 Appearance: Grayish-white ultrafine powder
💖 Purity: 99.9%
💖 Available Particle Sizes: Nanoscale 40–200 nm / Micron-scale 1–3 μm, 5–10 μm, 10–20 μm
💖 Key Features: High thermal conductivity, high insulation, heat-resistant, easy dispersion, high loading capacity

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