[ALL-IN-ONE REPAIR PAD] Comes with 1 solder tab that effectively addresses over 100 solder points, making it an essential tool for PCB maintenance.
[EASY TO USE] Effortlessly repair your phone's motherboard by peeling off the protective layer and applying the pad directly to the damaged area.
[OPTIMIZED FOR PERFORMANCE] This product enhances maintenance efficiency, achieving a seamless connection that eliminates virtual welding issues caused by uneven surfaces.
[RELIABLE DESIGN] Features retaining pins for added security, that the pads stay in place during repairs and do not fall off.
[DIMENSIONS FOR YOUR CONVENIENCE] Size is approximately 8x5.8 cm (2x2.3 inches); be sure to verify your specific size needs before buying.
وصف
Product Description:
Made of material,
Pad Rework-Mobile Phone IC Spot Soldering-Touch for BGA-PCB Pad.
Flying wire supplementary spot welding sheet phone maintenance motherboard flying wire pasting pad drop point traceless repair without circle.
Just peel off the protective layer, it can be used and repaired.
The for pads are reinforced with retaining pins and will never fall off.
Improve maintenance efficiency, achieve the pad effect& seamless.
The flatness is good, which can effectively prevent the virtual welding caused by unevenness.
Material: Copper wire+ PC
Size: approx. 4.8x5.8 cm/2x2.3 inches
1 Pc equals or exceeds 100 solder points of different shapes.