[Universal Diagonal Stencil] Designed for BGA reballing with a aluminum alloy stencil compatible with chips from to
[Precision Rework Kit] Includes hex wrench for secure adjustments ensuring accurate solder ball placement during CPU or mobile phone repairs.
[Durable Aluminum Construction] Lightweight yet sturdy frame resists warping for consistent rework performance on notebooks and digital devices.
[Easy Chip Clamping] Adjustable design accommodates varying chip sizes simplifying BGA soldering and plant tin rework processes.
[Compact Portable Solution] Ideal for technicians repairing laptops smartphones or other electronics requiring BGA reballing.

Item Type: BGA Reballing Station
Product Model: HT-90 90x90
Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5in
Application Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7in
Material: Aluminum alloy
Application: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products.
1 x BGA Reballing Station
1 x Hex Wrench