[Durable Aluminum Alloy Frame]: Crafted with lightweight and sturdy aluminum alloy, this reballing station ensures a long-lasting structure that withstands frequent use in electronics repair.
[Efficient Double Frame Design]: Equipped with two interchangeable frames and an extra mesh net, enhancing work efficiency by reducing the need for frequent replacements during chip reballing.
[Convenient Solder Ball Management]: Features a specially designed diversion slot on the upper cover that facilitates easy pouring and management of excess solder balls for a cleaner workspace.
[Versatile Compatibility]: Supports BGA chip sizes up to 50 x 50mm and fits steel mesh templates approximately 80 x 80mm, ensuring adaptability for various reballing projects.
[Complete DIY Kit]: Comes with all necessary tools for independent operation, making it perfect for DIY enthusiasts seeking a reliable rework station for solder ball planting.
وصف
Item Type: BGA Reballing Rework Station
Purpose: BGA chip planting ball
Specification: KF-13 double frame type 80 x 80 tin planting station
Plantable Chip Size: Maximum Size: Approx. 50 x 50mm / 2 x 2in
Applicable Steel Mesh Size: Approx. 80 x 80mm / 3.1 x 3.1in
Features: Aluminum alloy frame, light and durable material, accurate bearing guidance, accurate positioning.
Package List:
1 x BGA Reballing Rework Station (Composed of 3 Accessories)
1 x Hex Wrench
Note:
This BGA reballing rework station is only suitable for large steel meshes, not for small heating steel meshes.