محطة إعادة العمل BGA 90x90 مم، محطة BGA reballing من سبائك الألومنيوم لحام رقاقة وحدة المعالجة المركزية، حامل استنسل فولاذي ثابت عالمي لإصلاح PCB للهاتف المحمول
90x90mm Aluminum Alloy Construction: This BGA reballing station measures 90x90mm and is built from solid aluminum alloy. The lightweight yet durable frame provides a stable platform for precise chip soldering work.
Wide Chip Compatibility: Works with CPU chips from 9x9mm up to 43x43mm. This BGA rework station is perfect for notebook computer CPUs, mobile phone digital products, and other PCB repair tasks.
Universal Fixed Steel Design: The universal fixed steel structure holds BGA stencils securely in place. This soldering jig prevents movement during the manual soldering and plant tin rework process.
Complete Kit with Hex Wrench: Comes with a hex wrench for easy adjustment of the clamping width. This bga reballing station holder kit includes everything needed to get started with chip repair right away.
Ideal for BGA Stencil and Chip Repair: Use this bga chip repair station for plant tin reballing on game consoles, graphics cards, and mobile devices. A practical tool for professional technicians and hobbyists.
وصف
Item Type: BGA Reballing Station
Product Model: HT-90 90x90
Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5in
Application Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7in
Material: Aluminum alloy
Application: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products.
Package List:
1 x BGA Reballing Station
1 x Hex Wrench