2 Duo E8500 specifications
General information
Type
CPU / Microprocessor
Market segment
Desktop
Family
Model number ?
E8500
CPU part numbers
EU80570PJ0876M is an OEM/tray microprocessor
AT80570PJ0876M is an OEM/tray microprocessor in Halide free package
BX80570E8500 is a boxed microprocessor with fan and heatsink
BXC80570E8500 is a boxed microprocessor with fan and heatsink
BX80570E8500A is a boxed microprocessor with fan and heatsink
Frequency ?
3167 MHz
Bus speed ?
1333 MHz
Clock multiplier ?
9.5
Package
775-land Flip-Chip Land Grid Array (FC-LGA8)
Architecture / Microarchitecture
Microarchitecture
c
Processor c ?
Wolfdale
c steppings ?
C0 (SLAPK)
E0 (QHEY, SLB9K)
CPUIDs
10676 (SLAPK)
1067A (QHEY, SLB9K)
Manufacturing process
0.045 micron
410 million transistors
Die
107mm2
Data width
64 bit
The number of CPU cores
2
The number of threads
2
Floating Point Unit
Integrated
Level 1 cache size ?
2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size ?
shared 6 MB 24-way set associative cache
Multiprocessing
Uniprocessor
Features
MMX instructions
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSSE3 / Supplemental Streaming SIMD Extensions 3
SSE4.1 / Streaming SIMD Extensions 4.1 ?
EM64T / Extended Memory 64 technology / I 64 ?
NX / XD / Execute disable bit ?
VT-x / Virtualization technology ?
VT-d / Virtualization for directed I/O
TXT / Trusted Execution technology
Low power features
Enhanced / technology ?
Stop Grant state ?
Halt state
Extended Halt state
Extended Stop Grant State
Sleep state ?
Deep Sleep state ?
Deeper Sleep state ?
Integrated peripherals / components
Integrated graphics
None
Electrical / Thermal parameters
V c ?
0.85V - 1.3625V
Minimum/Maximum operating temperature ?
5°C - 72.4°C
Minimum/Maximum power dissipation ?
6 Watt (TDP in Deeper Sleep mode) / 100.31 Watt
Thermal Design Power ?
65 Watt