[WIDE COMPATIBILITY] This CPU tin plating stencil is designed for A53 A536 A33 A13 A21S M33 and more ensuring broad applicability for various phone repair scenarios. Its 0.12mm pitch guarantees precision across multiple device making it a versatile tool and DIY enthusiasts alike.
[HIGH TEMPERATURE RESISTANCE] Engineered to withstand high temperatures our tin reballing stencil maintains structural integrity during rapid tin plating processes. This durability ensures consistent performance and improved efficiency saving you time and effort during intricate repair tasks.
[ADVANCED HALF ENGRAVING TECHNOLOGY] Featuring multiple IC recesses with our specialized half engraving process this stencil effectively prevents small IC components from sticking to tin while protecting delicate corners from damage. This innovative design minimizes waste and enhances your rework precision.
[PRECISION ENGINEERED DESIGN] The compact yet robust construction of this tin plating stencil allows for exact positioning in various working environments. Its sleek profile and meticulous craftsmanship ensure reliable performance whether you're in a workshop or on the go handling emergency repairs.
[USER FRIENDLY PORTABILITY] Lightweight and easy to handle this CPU tin plating stencil is your perfect mobile repair companion. Its intuitive design simplifies the reballing process making it ideal for both maintenance professionals and hobbyists looking for efficient reliable tools.

Spec:
Item Type: Phone Tin Reballing Stencil
Material: Stainless steel
Pitch: Approx. 0.12mm / 0.005in
Applicable : Suitable for A33 A53 A536 A13 A21S M33, etc.

Package List：
1 x Phone Tin Reballing Stencil
Note：