[QUICK TINNING] Experience fast and precise tinning with our BGA reballing stencil designed to maintain accuracy without deforming under high temperatures. Its advanced design ensures quick solder application saving you time and effort during repairs.
[IC CHIP PROTECTION] The specially designed IC slots on this stencil prevent small IC tin from sticking and protect delicate chips from corner damage. This feature ensures your IC chips remain safe and intact during the reballing process.
[PERFECT FIT] This versatile stencil is compatible with C7010 J610 series and universally fits A7 A5 A3 S5 J7 series phones. Its precise design guarantees a perfect fit for various CPU making it an essential tool .
[DURABLE MATERIAL] Crafted from premium stainless steel this stencil boasts a sturdy structure that resists wear and tear. Its high temperature resistance and robust build ensure long lasting performance even with frequent use.
[PORTABLE DESIGN] Compact and lightweight this rework stencil is easy to carry and simple to use. Its user friendly design makes it ideal for both workshop and on the go repairs enhancing your productivity wherever you work.

Spec:
Item Type: Phone CPU BGA Reballing Stencil
Product Material: Stainless Steel
Spacing: 0.12mm
Applicable CPU: For MSN8916, MSN8953 CPU.
Applicable Product Model: For C7010, J610 series, universal for C7, J3, J5, A5, etc.

Package List：
1 x

Phone CPU BGA Reballing Stencil
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