[ MATERIAL] These BGA reballing stencils are crafted from premium stainless steel ensuring durability and resistance to deformation. The thickness of the steel mesh provides optimal performance during rework processes. Designed to withstand high temperatures from hot air machines these stencils maintain their shape for precise solder ball placement.
[VERSATILE SIZES] This comprehensive set includes 130 pieces with 6 different sizes to accommodate various BGA chip dimensions. Whether you're working on laptops desktops or graphics cards this kit has the right stencil for your needs. The included sizes cover solder balls from 0.35mm to 0.76mm making it suitable for most electronic repair scenarios.
[EASY IDENTIFICATION] Each stencil features clear surface markings indicating specifications for quick and accurate selection during your rework projects. This thoughtful design eliminates guesswork and saves valuable time when working with multiple chip sizes. The organized sizing system enhances workflow efficiency for professional technicians.
[HEAT PERFORMANCE] Engineered to withstand direct heat application these stencils remain stable under thermal stress without warping or distorting. The high temperature tolerance ensures consistent results across repeated uses making them ideal for intensive rework sessions. Professionals can rely on these stencils for precise solder ball alignment every time.
[COMPREHENSIVE APPLICATION] Specially designed for repairing various BGA chips including laptop and desktop motherboards communication main boards north-south bridges and graphics cards. This universal set covers nearly all common BGA chip sizes encountered in electronics repair making it an essential tool for repair shops and technicians.

Spec:
These stencils were made by material, can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.

Features:
These stencils are made of stainless steel, the