General information
Type
CPU / Microprocessor
Market segment
Desktop
Family
ph II X6
Model number ?
1100T
CPU part numbers
HDE00ZFBK6DGR is an OEM/tray microprocessor
HDE00ZFBGRBOX is a boxed microprocessor with fan and heatsink
Stepping codes
ACBBE CBCCBBE CB
Frequency ?
3300 MHz
Maximum turbo frequency
3700 MHz (3 cores or less)
Bus speed ?
667 MHz Memory controller
One 2000 MHz 16-bit HyperTransport link (4 GT/s)
Clock multiplier ?
16.5
Package
938-pin organic micro-PGA
Socket
Socket AM3
Weight
1.4oz / 38.4g (CPU)
1lb 0.7oz / 474.2g (box)
Architecture / Microarchitecture
Microarchitecture
K10
Platform
Leo
Processor c ?
Thuban
c stepping ?
PH-E0
CPUID
100FA0
Manufacturing process
0.045 micron silicon-on-insulator (SOI) technology
Die
346mm2
Data width
64 bit
The number of CPU cores
6
The number of threads
6
Floating Point Unit
Integrated
Level 1 cache size ?
6 x 64 KB 2-way set associative instruction caches
6 x 64 KB 2-way set associative data caches
Level 2 cache size ?
6 x 512 KB 16-way set associative exclusive caches
Level 3 cache size
Shared 6 MB 48-way set associative cache
Cache latency
3 (L1 cache)
Multiprocessing
Uniprocessor
Extensions and Technologies
MMX instructions
Extensions to MMX
3DNow! technology
Extensions to 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSE4a ?
Turbo c technology
Low power features
Cool'n'Quiet 3.0
c C1 and C1E states
Package S0, S1, S3, S4 and S5 states
Integrated peripherals / components
Integrated graphics
None
Memory controller
The number of controllers: 1
Memory channels: 2
Channel width (bits): 72
Supported memory: DDR2-1066, DDR3-1333
DIMMs per channel: up to 2
Maximum memory bandwidth (GB/s): 21.3
Other peripherals
HyperTransport 3 technology
Electrical / Thermal parameters
V c ?
1V - 1.475V
Maximum operating temperature ?
62°C
Thermal Design Power ?
125 Watt