1. [ROBUST MATERIAL] Crafted from durable stainless steel, these stencils withstand heating without deformation, ensuring consistent reballing results.
2. [COMPREHENSIVE SET] Includes 130pcs stencils in 6 different sizes, providing ample options for reballing tasks on various BGA chips.
3. [SEAMLESS SELECTION] The marked specifications help you quickly identify the right stencil, making the reballing process efficient and straightforward.
4. [RELIABLE PERFORMANCE] Heat- stencils guarantee and accuracy during reballing, making them ideal and DIY enthusiasts.
5. [VERSATILE APPLICATION] Designed for a wide range of BGA chips, this kit is suitable for repairs and replacements in laptops, desktops, graphics cards, and more.

Spec:
These stencils were made by high quality material, can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Features:
These stencils are made of high quality stainless steel, the thickness of steel mesh is perfect.
They can be heated by the hot air machine, these stencils are not easy to deform when heated.
There are 6 different sizes and totally 130pcs, enough to meet your various needs.
The specifications are marked on the surface, convenient for you to choose.
It is specially designed for laptop, desktop, communication main board north-south bridge, and graphics card, etc all kinds of BGA chips.
Specification:
Material: Stainless Steel
Color: Silver
Quantity: 130pcs
Weight: Approx. 268g / 9.5oz
Package List:
3pcs x BGA Stencils for 0.35mm Solder Ball
2pcs x BGA Stencils for 0.4mm Solder Ball
7pcs x BGA Stencils for 0.45mm Solder Ball
35pcs x BGA Stencils for 0.5mm Solder Ball
60pcs x BGA Stencils for 0.6mm Solder Ball
23pcs x BGA Stencils for 0.76mm Solder Ball