مميزات خاصة

[Premium Material]: Made from high quality 304 stainless steel, ensuring durable steel mesh with perfect thickness that resists deformation under heat for reliable reballing use.
[Heat Design]: Compatible with hot air machines, these stencils maintain shape and precision while reheated, making the reballing process efficient and hassle-free.
[Multiple Sizes Included]: Contains 33pcs across 5 different stencil sizes (0.35mm to 0.76mm solder ball diameters), providing versatility to handle various BGA chip layouts.
[Clearly Marked Specifications]: Each stencil is engraved with size information for quick identification and selection, streamlining your workflow for laptop and desktop repairs.
[Wide Application]: Specially designed for laptops, desktops, communication main boards, north-south bridges, and graphics cards, ideal for professional and hobbyist electronics technicians.

وصف

These stencils were made by high quality material, can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.

Features:
These stencils are made of high quality stainless steel, the thickness of steel mesh is perfect.
They can be heated by the hot air machine, these stencils are not easy to deform when heated.
There are 5 different sizes and totally 33pcs, enough to meet your various needs.
The specifications are marked on the surface, convenient for you to choose.
It is specially designed for laptop, desktop, communication main board north-south bridge, and graphics card, etc all kinds of BGA chips.

Specification:
Material: Stainless Steel
Color: Silver
Quantity: 33pcs
Weight: Approx. 61g / 2.2oz

Package List:
2pcs x BGA Stencils for 0.35mm Solder Ball
1pcs x BGA Stencils for 0.4mm Solder Ball
14pcs x BGA Stencils for 0.5mm Solder Ball
13pcs x BGA Stencils for 0.6mm Solder Ball
3pcs x BGA Stencils for 0.76mm Solder Ball

مرحبًا،

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