[FAST & ACCURATE TINNING] Experience -fast tinning with pinpoint accuracy thanks to our high-precision BGA reballing stencil. The advanced design ensures minimal deformation even under extreme temperatures, providing consistent results every time. Perfect who demand efficiency and reliability in their repair work.
[IC CHIP PROTECTION] Safeguard your delicate IC chips with our innovative stencil design. Specially engineered slots prevent tin adhesion and corner breakage, ensuring your components remain intact during the reballing process. This feature is a game-changer for preserving the integrity of small ICs.
[UNIVERSAL COMPATIBILITY] Enjoy unmatched versatility with a stencil that fits multiple CPU including SDM450 660 SM6150 MT6762 and A60-A90 series (A10S A605F A705F A920F). This all-in-one solution eliminates the need for multiple stencils, saving you time and money on your repair projects.
[PREMIUM STAINLESS STEEL] Built to last with high-grade stainless steel, our reballing template withstands repeated use without warping or wear. The robust construction maintains precise alignment over time, making it the most durable choice for professional technicians and repair shops.
[PORTABLE & USER-FRIENDLY] Designed for convenience, this compact and lightweight stencil is easy to transport and simple to operate. Whether you're working in-shop or on-site, the ergonomic design makes phone CPU rework effortless and efficient for technicians of all skill levels.

Spec:
Item Type: Phone CPU BGA Reballing Stencil
Product Material: Stainless Steel
Spacing: 0.12mm
Applicable CPU: For SDM450, 660, SM6150, MT6762 CPU.
Applicable Product Model: For A60-A90 series, A10S, A605F, A705F, A920F.

Package List：
1 x

Phone CPU BGA Reballing Stencil
Note：