High Performance: Uses TEC2-19006 chip delivering efficient cooling with maximum temperature difference of 80C for effective thermal management.
Easy Installation: Designed with user-friendly features for quick setup, perfect for electronics enthusiasts and professional applications.
Durable Design: Constructed from ceramic and semiconductor materials ensuring longevity under various operating conditions.
Sealed Protection: Includes four-way silicone rubber sealing to enhance cooling efficiency and prevent leakage.
Versatile Application: Ideal for various electronic cooling applications such as integrated circuits and devices requiring reliable thermoelectric cooling.

Features:
1. Ceramic and semiconductor?material, it has?Durability-Optimized
2. Four-way standard 704 silicone rubber sealing process
3. Using TEC2-19006 chip, the effect is good
4. Great workmanship and it is easy to install.
5.?Adopted of electronic components, and accuracy process, ensure for the durability
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Specification:
Condition:
Chip Model: TEC2-19006
Maximum Temperature Difference: . Tmax (Qc=0) 80℃?or more.
Working Current: Imax=6A (when rated voltage starts)
Rated Voltage: DC12V
Cooling Power: Qcmax 72W
Assembly Pressure: 85N/cm2
Working Environment: Temperature range -55℃?~ 83℃?(excessive ambient temperature will directly affect cooling efficiency)
Packaging Process: Four weeks standard 704 silicone rubber seal
Storage Conditions: -40~60℃
Material: Ceramic (two sides), semiconductor material (between two ceramic plates)
Size: Approx. 40 x 40 x 6.3mm / 1.6 x 1.6 x 0.2in
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Package List:
1 x Cooling Plate