مميزات خاصة

Compatible with M.2 SSD, Coolers, GPU, RTX 4090, IC Processor, VGA cards, CPU, Laptops, Desktop PC, Mini Desktop, Game Consoles, Memorys, SMD components, Heatsink, 3D Printer, Raspberry Pi etc.
Non-silicone based formulation, Low Shore Hardness, Low pressure versus deflection, No fiberglass reinforcement, Minimizes board and component stress.
Brand: Laird, model: TFLEX-SF10; Do NOt use Thermal pads to replace Thermal paste, or vice versa.
Dimension (Length x Width x Height): 70 x 20 x 0.75 mm; Color: Grey
Each pack come with: 1X 0.75x20x70mm Thermal Pad (Non-silicone based formulation).

وصف

Tflex SF10 is an innovative high performing thermal material in Laird's gap filler portfolio. The non-silicone based formulation material measures 10 W/mk and has excellent deflection properties which provides minimal pressure on components. Very little pressure is required to reach the lowest possible thermal resistance.

Compatible with M.2 SSD, GPU, CPU, Coolers, IC Processor, VGA cards, Laptops, Desktop PC, Mini Desktop, Game Consoles, Memorys, SMD components, Heatsink, 3D Printer, Raspberry Pi etc.

Compatible with Samsung 850EVO, 860EVO, 960EVO, 970EVO, 950PRO, 960PRO, 970PRO, SM951, SM961, PM951, PM961, CM871a, PM871, PM981, XP941, etc. (No Cutting required.)

Dimension (Length x Width x Height): 70 x 20 x 0.75 mm
Color: Grey
Density (g/cm3): 3.70
Hardness (Shore 00): 41
Thermal Conductivity (w/mK): 10.20
Operating Temperature: -40°C to -125°C

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{"error":"\u062e\u0637\u0623","cart_limit":"\u0644\u062f\u064a\u0643 \u0627\u0644\u0643\u062b\u064a\u0631 \u0645\u0646 \u0627\u0644\u0645\u0646\u062a\u062c\u0627\u062a \u0641\u064a \u0633\u0644\u0629 \u0627\u0644\u062a\u0633\u0648\u0642 \u0627\u0644\u062e\u0627\u0635\u0629 \u0628\u0643.","prod_limit":"\u0644\u0627 \u064a\u0645\u0643\u0646\u0643 \u0625\u0636\u0627\u0641\u0629 \u0627\u0644\u0645\u0632\u064a\u062f \u0645\u0646 \u0647\u0630\u0627 \u0627\u0644\u0645\u0646\u062a\u062c"}

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