Professional Design: Rework pad made of high quality copper wire and PC plastic plate, featuring reinforced retaining pins that securely hold in place during soldering operations, enabling precise IC point repair work on phones and electronic devices.
Versatile Application: Each pad equals or exceeds 100 solder points of different shapes, making it suitable for phone motherboard maintenance, BGA-PCB repairs, and flying wire soldering tasks that require meticulous attention to detail.
Easy To Use: Simply peel off the protective layer and the pad is ready for immediate use - no additional preparation required, helping technicians save time and improve repair efficiency while achieving seamless results.
Superior Flatness: The exceptional flatness of this rework pad effectively forestalls virtual welding issues caused by uneven surfaces, resulting in more reliable connections and professional-looking repairs without visible circles or traces.
Compact Size: Measuring approximately 4.8x5.8 cm/2x2.3 inches, this soldering pad is perfectly sized for detailed electronic repair work, providing ample working area while remaining compact enough for precision tasks on small components.
وصف
Product Description:
Made of material,
Pad Rework-Phone IC Spot Soldering-Touch for BGA-PCB Pad.
Flying wire supplementary spot welding sheet phone maintenance motherboard flying wire pasting pad drop point traceless repair without circle.
Just peel off the protective layer, it can be used and repaired.
The for pads are reinforced with retaining pins and will never fall off.
Improve maintenance efficiency, achieve the pad effect& seamless.
The flatness is good, which can effectively prevent the virtual welding caused by unevenness.
Material: Copper wire+ PC plastic plate
Size: approx. 4.8x5.8 cm/2x2.3 inches
1 Pc equals or exceeds 100 solder points of different shapes.