Designed with versatility in mind, suitable for smartphones like the X, Galaxy S21, Pixel 3 XL, 7T Pro, and others
Compatible with popular smartphone like the Galaxy Note 10 Plus, Galaxy Tab 8.0, Galaxy Watch 3, and others
Utilizes high-quality stainless steel material for its robustness and durability
Features multiple IC slots for smaller ICs during the reballing process to minimize damage to delicate components
Promotes fast tin planting speed for enhanced efficiency during repairs
وصف
Item Type: BGA Reballing Stencil Material: Stainl Steel Spacing: 0.12mm Applicable CPU: For Snapdragon 888, for SM8350, for xyn2100 CPU Applicable : For + Ultra series, for G998U G996U Z Flip3 Z Fold3 W 22, etc.