The pagoda nozzle has a minimum outer diameter of 7mm and can be connected to an inner diameter of 7-8mm Water pipe.
Applications: Special water cooling block, liquid cooling plate and water heat exchanger for semiconductor thermoelectric cooling modules. Perfectly matched with cooling chips, it can be used for heat dissipation, cold conduction and cold water circulation projects.
The surface of the water cooling block is polished, with an M-shaped internal flow channel. All components are integrated into a single unit via brazing.
Suitable for cooling computer CPUs, graphics cards (GPUs), Xbox console CPUs, thermoelectric cooling chips, industrial variable frequency drives, and industrial control cabinets.
وصف
Size:40×40×12mm.
Weight: 40g
Material: aluminum alloy
Processing: vacuum aluminum brazing
M-shaped internal flow channel
Compatible with 7–8mm ID hoses
Applications: PC CPU, GPU, TEC modules
Package Includes: 2 Water Cooling Blocks