Dow Corning TC-5888 Thermally Conductive Compound
1kg one Bucket
Grey

Gray, thixotropic, non-curing thermally conductive compound. Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of modules, including computer MPUs and power modules.

Uses
Dow Corning TC-5888 Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of modules, including computer MPUs and power modules

Benefits
One-Part Material: No cure is required when applying the material.
Excellent Stay-ability: Features unique rheological properties that limit its flow beyond a target interface once assembled. This flow characteristic distinguishes it from lower viscosity thermal compounds, and provides greater control for applications requiring a thicker thermal compound layer or greater precision when dispensing compound between surface interfaces.
Thermal Stability: Delivers consistent performance and reliability under high temperatures.
Good Processability: Offers low volatile content versus competitive thermal compounds, allowing for more consistent rheology, application repeatability, and easier screen printing overall.

Composition
Thermally conductive fillers
Siloxane polymer matrix

Color: Gray
One Part Material: Non-curing
Viscosity At Low Strain Rate: 1,200 Pa·s
Viscosity At High Strain Rate: 100 Pa·s
Specific Gravity: 2.6
Volatile Content, 48 hours at 125°C: 0.02 %
Thermal Conductivity: 5.2 W/mK
Thermal Resistance at 25 N/cm²: 0.05 °C·cm²/W
Bond Line Thickness at 25 N/cm²: 0.02 mm, 0.0008 inch

Suitable for LED Lighting, DT, NB, VGA, IPC, CPU, GPU, IC, Chipset